Device Research Conference DRC and IEEE

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Conference Information

Technical Program

   Plenary Session

   Invited Presentations

   Rump Sessions

   Social Events

   Short Course

   Advance Program


Presenter Information


Technical Program—Advance Program

Monday | Tuesday | Wednesday

Wednesday AM, June 26, 2013
Location: Jordan Auditorium, Mendoza College of Business
Joint DRC/EMC Plenary Session
8:20 AM EMC Welcome
EMC Introductory Remarks
EMC Awards
10:00 AM
Wednesday AM, June 26, 2010
Location: Jordan Auditorium, Mendoza College of Business
Session VI.A Process and Testing Innovations
Session Organizer: TBA
Session Chair(s): TBA
10:00 AM VI.A.-1 Invited Paper
Tuning the Fermi level position at metal/high-k interfaces
M. Eizenberg and L. Kornblum, Department of Materials Science and Engineering, Technion – Israel Institute of Technology, Haifa, ISRAEL
10:40 AM VI.A.-2 Student Paper
Extraction of Series Resistance on Junctionless and Inversion-mode nanowire FET through the Method based on Y-function
C.-H. Park1, M.-D. Ko1, K.-H. Kim1, J.-H. Hong1, R.-H. Baek2, J.-S. Yoon3, J.-S. Lee1,4, and Y.-H. Jeong1,3,4, 1Dept. of Electrical Engineering, POSTECH, 2SEMATECH, Albany, New York, USA, 3Dept. of Creative IT Excellence Engineering, and 4Division of IT-Convergence Engineering, POSTECH, Pohang, Gyeongbuk, KOREA
11:00 AM VI.A.-3 Student Paper
Miniaturized On-Chip Passive Devices based on Self-Rolled-Up SiNx Nanomembrane Inductive Tube
W. Huang1, X. Yu1, T. Comberiate1, C.-W. Qiu2, J. E. Schutt-Ainé1, and X. Li1, 1Department of Electrical and Computer Engineering, University of Illinois, Urbana, Illinois, USA and 2Department of Electrical and Computer Engineering, National University of Singapore, SINGAPORE
11:20 AM VI.A.-4 Student Paper
Solution-processed High-k Dielectrics for Low-Voltage IGZO TFTs
S.-B. Ji, H. Im, N. Seong, and Y. Hong, Department of Electrical Engineering and Computer Science and Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, KOREA
11:40 AM VI.A.-5 Invited Paper
Heat dissipation and thermometry in nanosystems: when interfaces dominate
B. Gotsmann, F. Menges, S. Karg, V. Troncale, M. Lantz, P. Mensch, H. Schmid, P. Das Kanungo, U. Drechsler, V. Schmidt, M. Tschudy, A. Stemmer, and H. Riel, IBM Research - Zurich, Nanotechnology Group, ETH-Zurich, SWITZERLAND

Monday | Tuesday | Wednesday

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